![]() SpeedStack mezzanine connectors are designed for space-constrained OEM applications in telecommunications, networking, military, medical and many consumer devices. SpeedStack was designed to optimize high-speed data transmission and rugged product reliability in a very slim and dense mechanical envelope. Theres heightened demand for system cooling and maximization of PCB real estate in high-speed board-to-board applications, states Adam Stanczak, global new product development manager, Molex. SpeedStack connectors will be displayed at Molex booth 117, DesignCon 2014, January 29-30, Santa Clara, CA. Compact SpeedStack connectors feature a stack height of 4.00mm and support data rates up to 40 Gbps per differential pair. The Molex SpeedStack mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications.
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